General Information
PCL-GI-785 Laminate/PCL-GIP-785 Prepreg
Polyimide Laminates and Prepregs (Tg 260°C)
DOWNLOAD (PDFs): DATA SHEET | PCL-GI-785 MSDS | PCL-GIP-785 MSDS
PCL-GI-785 and PCL-GIP-785 comprise a comprehensive product line of polyimide copper-clad laminates and prepregs based on bismaleimide (BMI) type resin. 785's all-polyimide resin system provides the greatest thermal performance available in conventional laminate materials for PWB applications. It excels in hostile assembly procedures and extreme operating environments to provide reliability and long service life.
KEY FEATURES
- 100% Polyimide Resin
- No blended or "co-polymer" chemistry
- Simple, homogeneous, consistent
- High Tg and Low Z-Axis CTE
- >250°C (by DSC)
- < 1.5% expansion (approximately 45 ppm/°C) from Ambient to Tg
- Non-brominated, non-MDA
- Unexcelled thermal stability, without evolution of halogens
- No carcinogenic concerns; meets all OSHA 1910.1050 requirements
- Engineered and manufactured to toughest standards
- Standard surface quality is Class C (IPC-4101A) without problems from resin spots or other surface defects
- Balanced multi-ply constructions for minimal curl/warp and optimum DS
- Thickness tolerance of Class C is standard (IPC-4101A)
- Minimum dielectric spacing of 0.0035" by cross-section available on request
- Institutional Certification
- Meets IPC-4101A, -40 and -41 requirements
- UL certification as ANSI Type GPY1
LAMINATE AVAILABLITY
PCL-GI-785 is available from 0.0025"(.0635mm) to 0.125" (3.175mm) base thickness. Polyclad offers glass constructions that are engineered for optimal performance using multi-ply builds in all cores from 0.0030" (0.076mm) and greater. Standard sheet size is 48.0"x36.0", grain in the 48.0". Panels are cut from that sheet size. Other sheet and panel sizes are be available by special order. Copper foil is Type H of IPC-4101A (drum side out, HTE). Standard copper thicknesses are 3/8, H, 1, 2 oz. Other copper thicknesses and types available by special order.
PREPREG AVAILABILITY
PCL-GIP-785 is available in standard glass styles: 106, 1280, 2313, 2116, and 7628. The prepreg when used as multilayer board bonding plies will exhibit cured properties and performance identical to PCL-GI-785 laminates. Prepreg flow characteristics are engineered to provide proper filling and adhesion plus consistent dielectric thickness using press cycles of conventional parameters.
PROCESSING AND STORAGE
785 laminates and prepregs are compatible with and perform well using conventional polyimide process techniques. A technical bulletin with detailed recommendations for processing and fabrication procedures is available.
Recommended storage conditions for 785 laminates and prepregs is the same as FR-4 materials. Prepregs should be stored at 68±3° F (18±2°C) and 30-50% relative humidity. Prepregs stored below the recommended temperature should be allowed to equilibrate to ambient conditions for a minimum of eight hours prior to use. Contact Polyclad Technical Services for more detailed information on processing and storing 785 laminates and prepreg.
APPLICABLE SPECIFICATIONS AND RECOGNITIONS
785 Laminates and prepregs are certified to IPC-4101A, Specification for Base Materials for Rigid and Multilayer Printed Boards, Specification Sheets IPC-4101/40 and /41. Other industry or customer specific specifications, recognitions or designations may be applicable or certifiable to in certain cases.
Polyclad's UL file number is E45456. PCL-GI-785 laminate and PCL-GIP-785 prepreg are listed under these designations1. These materials and printed wiring boards constructed from them have a HB rating when tested in accordance with UL Standard 94. Relative Thermal Index and Maximum Operating Temperature is 170°C. For additional information, please contact Polyclad Technical Services.
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